Patent Applicant:侯建华
Patent description:一种莲藕状多孔碳/卤氧铋半导体复合光催化材料、制备及应用
Type of Patent:发明
State of Patent:#N/A
Application Number:201610573944.7
Number of Inventors:6
Service Invention or Not:no
Application Date:2016-07-20
First Author:Hou jianhua