扬州大学教师个人主页服务平台刘洋--中文主页-- Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging

已经得到个称赞给我点赞

论文成果

当前位置: 中文主页 >> 科学研究 >> 论文成果

Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging

上一条：Hierarchical SnO2 hollow nanotubes as anodes for high performance lithium-ion battery

下一条：Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint