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Affilication of Author(s):扬州大学

Scope of patent:电化学分析

School Sign:扬州大学

Patent Applicant:王洋

Patent description:一种基于共价有机骨架材料修饰碳糊电极的制备方法

Type of Patent:发明

State of Patent:专利申请尚未授权

Application Number:201810184155.3

Number of Inventors:3

Service Invention or Not:no

Application Date:2018-03-07

Authorization Date:2020-06-16

First Author:WangYang