一种关于金花菜硬实种子的种皮切割装置
- Patent Applicant:魏臻武
- Patent description:一种关于金花菜硬实种子的种皮切割装置
- Type of Patent:实用新型
- State of Patent:#N/A
- Application Number:201720452877.3
- Number of Inventors:5
- Service Invention or Not:no
- Application Date:2017-04-27
- First Author:Zhenwu Wei
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