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Affilication of Author(s):扬州大学

Scope of patent:机械设计原理与方法

School Sign:扬州大学

Disigner of the Invention:尹彬沣

Patent description:一种基于微流控芯片用打孔装置

Type of Patent:实用新型

Application Number:202222044844.9

Number of Inventors:4

Service Invention or Not:no

Application Date:2022-08-04

Authorization Date:2022-11-29

First Author:Yin Binfeng