副高级
Supervisor of Master's Candidates
Main positions:院国际交流与留学生教管中心副主任
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Affilication of Author(s):扬州大学
School Sign:扬州大学
Disigner of the Invention:郭沈天
Patent description:芯片打孔机
Type of Patent:外观设计
Application Number:202230523091.2
Number of Inventors:2
Service Invention or Not:no
Application Date:2022-08-11
First Author:Yin Binfeng
