Affilication of Author(s):扬州大学
School Sign:扬州大学
Disigner of the Invention:杨金彭
Patent description:一种利用杂化异质结实现有机半导体器件欧姆接触的方法
Type of Patent:发明
Application Number:202210830363.2
Number of Inventors:3
Service Invention or Not:no
Application Date:2022-07-15
First Author:Jinpeng Yang