基于积温补偿算法的玉米生长模拟改进方法及系统
Date:2024-06-07 clicks:
Affilication of Author(s):扬州大学
Scope of patent:农业工程
School Sign:扬州大学
Disigner of the Invention:张超
Patent description:基于积温补偿算法的玉米生长模拟改进方法及系统
Type of Patent:发明
Application Number:202410235053.5
Number of Inventors:6
Service Invention or Not:no
Application Date:2024-03-01
First Author:Zhang Chao