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Yin Binfeng

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副高级  
Supervisor of Master's Candidates  

Main positions:院国际交流与留学生教管中心副主任

Patents

一种手持式微流控芯片打孔器

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Affilication of Author(s):扬州大学

School Sign:扬州大学

Disigner of the Invention:尹彬沣

Patent description:一种手持式微流控芯片打孔器

Type of Patent:实用新型

Application Number:202222478973.9

Number of Inventors:3

Service Invention or Not:no

Application Date:2022-09-20

First Author:Yin Binfeng

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