副高级
Supervisor of Master's Candidates
Main positions:院国际交流与留学生教管中心副主任
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Affilication of Author(s):扬州大学
School Sign:扬州大学
Disigner of the Invention:尹彬沣
Patent description:一种芯片加工用对准平台
Type of Patent:实用新型
Application Number:202222544777.7
Number of Inventors:3
Service Invention or Not:no
Application Date:2022-09-26
First Author:Yin Binfeng
