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正高级

Supervisor of Master's Candidates

Date of Birth:1985-02-24

Date of Employment:2019-12-16

School/Department:电气与能源动力工程学院

Education Level:With Certificate of Graduation for Doctorate Study

Gender:Male

Degree:Doctoral Degree in Engineering

Status:在岗

Alma Mater:哈尔滨理工大学

刘洋

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Date of Birth:1985-02-24

Gender:Male

Education Level:With Certificate of Graduation for Doctorate Study

Alma Mater:哈尔滨理工大学

Paper Publications

Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu

Affiliation of Author(s):电气与能源动力工程学院
Journal:JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Co-author:任柏桥,周敏,曾祥华,孙凤莲
First Author:LY
Correspondence Author:刘洋
Volume:31(11)
Page Number:8258-8267
ISSN No.:0957-4522
Translation or Not:no
Date of Publication:2020-01-01