刘洋
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Date of Birth:1985-02-24
Gender:Male
Alma Mater:哈尔滨理工大学
Scientific Research
Current position:
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Scientific Research
Research Field
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Paper Publications
- Liu Yang,刘洋,夏阳晶,薛玉雄,赵雪薇,李男男,朱政强,邢朝洋.Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints.JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,308915-8924.
- Liu Yang,刘洋,徐鑫,薛玉雄,邢朝洋.An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints.JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY,2024,38(17)3348-3362.
- Liu Yang,薛玉雄,周敏,曹荣幸,曾祥华,李红霞,郑澍,张爽.Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints.SOLDERING & SURFACE MOUNT TECHNOLOGY,2022,34(3)153-161.
- Liu Yang,常健,薛玉雄,曹荣幸,李红霞,郑澍,曾祥华.Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2022,33(10)8270-8280.
- Liu Yang,薛玉雄,常健,曹荣幸,李红霞,郑澍,曾祥华.Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2022,33(10)8270-8280.
Patents
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