刘洋
Date of Birth:1985-02-24
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:哈尔滨理工大学
Paper Publications
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LY,夏阳晶,薛玉雄,赵雪薇,李男男,朱政强,邢朝洋.Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints.JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,308915-8924.
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LY,徐鑫,薛玉雄,邢朝洋.An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints.JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY,2024,38(17)3348-3362.
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LY,薛玉雄,周敏,曹荣幸,曾祥华,李红霞,郑澍,张爽.Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints.SOLDERING & SURFACE MOUNT TECHNOLOGY,2022,34(3)153-161.
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LY,常健,薛玉雄,曹荣幸,李红霞,郑澍,曾祥华.Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2022,33(10)8270-8280.
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LY,常健,曹荣幸,李红霞,郑澍,曾祥华.Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2022,33(10)8270-8280.
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LY,薛玉雄,周敏,曹荣幸,曾祥华,李红霞,郑澍,张爽.Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints.SOLDERING & SURFACE MOUNT TECHNOLOGY,2022,34(3)153-161.
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LY,常健,周敏,薛玉雄,曾祥华,孙凤莲.Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.MODERN PHYSICS LETTERS B,2020,34(36)
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LY,张鹏,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Hierarchical SnO2 hollow nanotubes as anodes for high performance lithium-ion battery.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(18)22944-22952.
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LY,任柏桥,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(14)18968-18977.
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LY,任柏桥,薛玉雄,周敏,曹荣幸,曾祥华.Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging.MATERIALS RESEARCH EXPRESS,2021,8(7)
