Affiliation of Author(s):电气与能源动力工程学院
Journal:MODERN PHYSICS LETTERS B
Co-author:常健,周敏,薛玉雄,曾祥华,孙凤莲
First Author:LY
Volume:34(36)
ISSN No.:0217-9849
Translation or Not:no
Date of Publication:2020-01-01
刘洋
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Date of Birth:1985-02-24
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:哈尔滨理工大学
Paper Publications
Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump
