扬州大学教师个人主页服务平台 Liu Yang--Home-- Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

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Supervisor of Doctorate Candidates

Date of Birth:1985-02-24

School/Department:电气与能源动力工程学院

Gender:Male

Degree:Doctoral Degree in Engineering

Alma Mater:哈尔滨理工大学

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刘洋

Date of Birth:1985-02-24

Gender:Male

Alma Mater:哈尔滨理工大学

Paper Publications

Current position: Home / Scientific Research / Paper Publications

Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Affiliation of Author(s):电气与能源动力工程学院
Journal:JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Co-author:夏阳晶,薛玉雄,赵雪薇,李男男,朱政强,邢朝洋
First Author:Liu Yang
Correspondence Author:刘洋
Volume:30
Page Number:8915-8924
ISSN No.:2238-7854
Translation or Not:no
Date of Publication:2024-01-01

Next One:An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints