Affiliation of Author(s):电气与能源动力工程学院
Journal:JOURNAL OF ELECTRONIC PACKAGING
Co-author:李昭,周敏,曾祥华,孙凤莲
First Author:LY
Correspondence Author:刘洋
Volume:143(3)
ISSN No.:1043-7398
Translation or Not:no
Date of Publication:2021-01-01