Affiliation of Author(s):电气与能源动力工程学院
Journal:MICROELECTRONICS RELIABILITY
Co-author:任柏桥,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华
First Author:LY
Volume:127
ISSN No.:0026-2714
Translation or Not:no
Date of Publication:2021-01-01
刘洋
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Date of Birth:1985-02-24
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:哈尔滨理工大学
Paper Publications
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging
