Affiliation of Author(s):电气与能源动力工程学院
Journal:JOURNAL OF ELECTRONIC PACKAGING
Co-author:李昭,周敏,曾祥华,孙凤莲
First Author:LY
Volume:143(3)
ISSN No.:1043-7398
Translation or Not:no
Date of Publication:2021-01-01
刘洋
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Date of Birth:1985-02-24
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:哈尔滨理工大学
Paper Publications
Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
