Affilication of Author(s):扬州大学
Scope of patent:材料实验
School Sign:扬州大学
Disigner of the Invention:刘洋
Patent description:一种高导热堆叠芯片结构及制备方法
Type of Patent:发明
Application Number:202310196813.1
Number of Inventors:7
Service Invention or Not:no
Application Date:2023-03-03
First Author:LY