Affilication of Author(s):扬州大学
Scope of patent:材料科学基础学科
School Sign:扬州大学
Disigner of the Invention:刘洋
Patent description:基于神经网络的互连结构工作温度及电流密度预测方法
Type of Patent:发明
Application Number:202310938014.7
Number of Inventors:10
Service Invention or Not:no
Application Date:2023-07-27
First Author:LY