Affilication of Author(s):扬州大学
Scope of patent:半导体技术
School Sign:扬州大学
Disigner of the Invention:刘洋
Patent description:基于神经网络的射频微系统三维封装工艺良率预测方法
Type of Patent:发明
Application Number:202411498420.7
Number of Inventors:8
Service Invention or Not:no
Application Date:2024-10-25
First Author:LY