扬州大学教师个人主页服务平台刘洋--中文主页--论文成果

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正高级
硕士生导师
教师拼音名称：LY
出生日期：1985-02-24
入职时间：2019-12-16
所在单位：电气与能源动力工程学院
学历：博士研究生毕业
性别：男
学位：工学博士学位
在职信息：在岗
毕业院校：哈尔滨理工大学

论文成果

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[11]刘洋,李昭,周敏,曾祥华,孙凤莲.Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint.JOURNAL OF ELECTRONIC PACKAGING,2021,143(3)
[12]刘洋,任柏桥,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging.MICROELECTRONICS RELIABILITY,2021,127
[13]刘洋,李昭,张浩,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Plasticity enhancement of nano-Ag sintered joint based on metal foam.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(6)7187-7197.
[14]刘洋,任柏桥,周敏,曾祥华,孙凤莲.Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(11)8258-8267.
[15]刘洋,任柏桥,周敏,薛玉雄,曾祥华,孙凤莲,樊学军,张国旗.Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints.APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2020,126(9)
[16]刘洋,常健,周敏,薛玉雄,曾祥华,孙凤莲.Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.MODERN PHYSICS LETTERS B,2020,34(36)
[17]刘洋,张鹏,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Hierarchical SnO2 hollow nanotubes as anodes for high performance lithium-ion battery.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(18)22944-22952.
[18]刘洋,任柏桥,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging.MICROELECTRONICS RELIABILITY,2021,127
[19]刘洋,李昭,周敏,曾祥华,孙凤莲.Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint.JOURNAL OF ELECTRONIC PACKAGING,2021,143(3)
[20]刘洋,李昭,张浩,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Plasticity enhancement of nano-Ag sintered joint based on metal foam.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(6)7187-7197.

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