刘洋
Date of Birth:1985-02-24
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:哈尔滨理工大学
Paper Publications
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LY,任柏桥,薛玉雄,周敏,曹荣幸,曾祥华.Improvement on the mechanical properties of eutectic Sn58Bi alloy with porous Cu addition during isothermal aging.MATERIALS RESEARCH EXPRESS,2021,8(7)
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LY,任柏桥,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(14)18968-18977.
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LY,任柏桥,周敏,薛玉雄,曾祥华,孙凤莲,樊学军,张国旗.Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints.APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2020,126(9)
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LY,任柏桥,周敏,曾祥华,孙凤莲.Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(11)8258-8267.
