刘洋
Date of Birth:1985-02-24
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:哈尔滨理工大学
Paper Publications
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LY,李昭,周敏,曾祥华,孙凤莲.Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint.JOURNAL OF ELECTRONIC PACKAGING,2021,143(3)
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LY,任柏桥,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging.MICROELECTRONICS RELIABILITY,2021,127
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LY,李昭,张浩,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Plasticity enhancement of nano-Ag sintered joint based on metal foam.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(6)7187-7197.
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LY,任柏桥,周敏,曾祥华,孙凤莲.Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(11)8258-8267.
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LY,任柏桥,周敏,薛玉雄,曾祥华,孙凤莲,樊学军,张国旗.Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints.APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2020,126(9)
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LY,常健,周敏,薛玉雄,曾祥华,孙凤莲.Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.MODERN PHYSICS LETTERS B,2020,34(36)
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LY,张鹏,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Hierarchical SnO2 hollow nanotubes as anodes for high performance lithium-ion battery.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(18)22944-22952.
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LY,任柏桥,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging.MICROELECTRONICS RELIABILITY,2021,127
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LY,李昭,周敏,曾祥华,孙凤莲.Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint.JOURNAL OF ELECTRONIC PACKAGING,2021,143(3)
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LY,李昭,张浩,薛玉雄,周敏,曹荣幸,陈鹏辉,曾祥华.Plasticity enhancement of nano-Ag sintered joint based on metal foam.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2021,32(6)7187-7197.
